发明名称 BOND APPLYING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a bond applying device wherein the even precision in rotational angle is provided over the entire nozzle head while the zero point adjustment of the rotational angle for each nozzle head is easily done. SOLUTION: A plurality of nozzle heads 14... for discharging a bond on a substrate 100 and a rotation means which rotates the nozzle heads 14... inθrotational direction, respectively, are provided. The rotation means comprises a plurality of first screw gears 17... which, individually engaged with each of the plurality of nozzle heads 14..., rotate the nozzle heads 14... in theθrotational direction while rotated coaxially with each of the nozzle heads 14..., a drive shaft 22 which is rotated and driven by a drive source 20, and a plurality of second screw gears 24... which is, born on the drive shaft 22, individually engaged with each of the plurality of first screw gears 17....
申请公布号 JP2000013008(A) 申请公布日期 2000.01.14
申请号 JP19980178978 申请日期 1998.06.25
申请人 JUKI CORP 发明人 HIRAMATSU TORU;FUKUI EIJI
分类号 B05C11/00;H05K3/34;(IPC1-7):H05K3/34 主分类号 B05C11/00
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