| 摘要 |
PROBLEM TO BE SOLVED: To improve flatness of a surface where the head of a press part touches, and at the same time to maintain the flatness for a long time of the thermocompression bonding head of a thermocompression bonding device. SOLUTION: In the thermocompression bonding head of a device, a ceramic layer 15 with a specific thickness is provided at a contacting part 130a of a press part 130 of a head body 13. The thermal expansion coefficients of the head body 13 and the ceramic layer 15 are set within±30% below 400 deg.C.
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