| 摘要 |
PROBLEM TO BE SOLVED: To realize arrangement technology of a circuit pattern on an insulation metal substrate, capable of magnifying an effective circuit pattern area on the insulation metal substrate. SOLUTION: A main circuit pattern 3 and a dummy pattern 4 surrounding the main pattern 3 are formed on peripheries of a product pattern 2 to be an insulation metal substrate, and the dummy pattern 4 is punched out from the insulation metal substrate with the use of a punching press.
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