发明名称 HEAT TREATMENT SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a system for heat treating a substrate under reduced pressure while enhancing uniform heating properties. SOLUTION: The heat treatment system comprises rod-like heating lamps 14, 15 arranged in parallel above and below a heat treatment container for containing a substrate to be treated in parallel. The upper and lower infrared heating lamps are arranged in the intersecting directions and the substrate is irradiated with light from the upper and lower infrared heating lamps and heated.
申请公布号 JP2000012480(A) 申请公布日期 2000.01.14
申请号 JP19980178195 申请日期 1998.06.25
申请人 KOKUSAI ELECTRIC CO LTD 发明人 SUZUKI MASAYUKI
分类号 H01L21/26;(IPC1-7):H01L21/26 主分类号 H01L21/26
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