| 摘要 |
PROBLEM TO BE SOLVED: To stabilize an external form and a dimension of a mold resin layer coating a semiconductor chip on a mounting board. SOLUTION: In this molding method, a screen 11 is overlapped on a mounting board 1 on which a semiconductor chip 3 is mounted, and a mold resin R is injected by use of a syringe 13 from directly above an opening 12 of the screen 11, and continuously the excessive mold resin R is scratched off by a squeegee 14 sliding on an upper face of the screen 11 to flatten the upper face, and the screen 11 is separated to solidify a mold resin layer. As an air is not rolled in a resin injection, a deforming process is unrequired and further a change of a surface of the mold resin layer followed by defoaming does not occur. As an external form or dimension of the mold resin layer is determined by the opening 12 of the screen 11, it is stabilized at all times.
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