发明名称 Elektrisches Verfahren, um Positionsfehler an den Kontaktöffnungen in einer Halbleitervorrichtung zu erkennen
摘要 A method for detecting a positional deviation of a contact hole formed in an interlayer insulator layer includes the steps of forming a detection conductor pattern on a substrate at a peripheral portion of a contact hole formation area in which a contact hole is to be formed, and forming a first insulating layer to cover the detection conductor pattern. Then, a first conducting layer of a predetermined pattern is formed on the first insulating layer to cover the contact hole formation area, and a second insulating layer is formed to cover the first conducting layer. Furthermore, a contact hole is formed at the contact hole formation area in the second insulating layer, and a second conducting layer is deposited on the second insulation layer so that the second conducting layer is deposited within the contact hole. Thereafter, a short-circuit between the detection conductor pattern and one of the first and second conducting layers is detected. When the short-circuit is detected, it is judged that the formed contact hole adversely deviates from a proper position where the contact hole is to be formed.
申请公布号 DE69033386(D1) 申请公布日期 2000.01.13
申请号 DE1990633386 申请日期 1990.02.27
申请人 NEC CORP., TOKIO/TOKYO 发明人 TAKAHASHI, YASUSHI
分类号 G01R31/26;H01L21/66;H01L21/768;H01L23/522;(IPC1-7):H01L21/66 主分类号 G01R31/26
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