发明名称 |
POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS |
摘要 |
A post-treatment method for copper on printed circuit boards is disclosed. The method comprises forming a cupric-based organometallic conversion coating on a copper surface of a printed circuit board, and then converting the cupric-based organometallic conversion coating to a cuprous-based organometallic conversion coating. The resulting cuprous-based organometallic conversion coating is desirable in that it improves copper to dielectric bond integrity.
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申请公布号 |
WO0002426(A1) |
申请公布日期 |
2000.01.13 |
申请号 |
WO1999US14983 |
申请日期 |
1999.07.01 |
申请人 |
ALPHA METALS, INC. |
发明人 |
MCGRATH, PETER, T.;OWEI, ABAYOMI;SARDER, SAEED;YAKOBSON, ERIC |
分类号 |
C23C22/52;C23C22/83;H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
C23C22/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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