| 摘要 |
<p>A method of mounting a piezoelectric element with a substrate. First, a compliant material (206) is dispensed on at least one side of the substrate (102) and cured. Next, a first conductive adhesive (216) is applied on the other side of the substrate (106). Third, a piezoelectric element (102) is positioned over the substrate (106). And thereafter, a second compliant conductive adhesive (222) is selectively dispensed such that it contacts an upper portion of one side of the piezoelectric element (102) and the substrate (106).</p> |
