发明名称 |
VERTICALLY INTERCONNECTED ELECTRONIC ASSEMBLIES AND COMPOSITIONS USEFUL THEREFOR |
摘要 |
<p>In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.</p> |
申请公布号 |
EP0970480(A1) |
申请公布日期 |
2000.01.12 |
申请号 |
EP19980902647 |
申请日期 |
1998.01.27 |
申请人 |
ORMET CORPORATION |
发明人 |
GALLAGHER, CATHERINE, A.;MATIJASEVIC, GORAN, S.;GANDHI, PRADEEP;CAPOTE, M., ALBERT |
分类号 |
H05K1/11;B23K35/02;H01B1/22;H01L23/498;H01L23/538;H05K1/09;H05K3/32;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H05K3/46;H01B1/02;H05K1/14;H05K1/05 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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