| 摘要 |
The transport device removes individual integrated circuits (6,6',6'') from a semiconductor wafer (5) positioned on a wafer table (3) via a suction head (4) for transfer to a system carrier (11,11',11'') supported by a conveyor band (2), with rotation of the wafer table about its center and linear displacement in coordinate direction (x,y) in discrete steps used for bringing each integrated circuit into the removal position (A). |
