PRESSURE-SENSITIVE ADHESIVE

摘要

The present invention provides a pressure-sensitive adhesive having a storage modulus from 1x 10<5> to 1x 10<6> dyne/cm<2> and at a frequency of 1 Hz; and having a gel fraction of 55% or more when the storage modulus is measured at a temperature of 25 DEG C in dynamic viscoelasticity measurement. Its pressure-sensitive adhesive product can be obtained by the process, for example, for producing the (meth)acrylate emulsion-type pressure-sensitive adhesive which comprises adding the polymerization-initiator(s) at separate multi-steps to the present reaction system in the presence of polymerization-initiator(s) at the time of polymerizing alkyl (meth)acrylate and which comprises using a water-soluble polymerization-initiator at least one time during or after the second step of adding the polymerization-initiator(s).