发明名称 |
PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD |
摘要 |
<p>In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101 SIMILAR 103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 is previously formed in a central portion of the innerlayer conductor circuit 161 located at the bottom of the blind via-hole 141, and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes 141, 142. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits 13, 161 and the blind via-holes 141, 142. <IMAGE></p> |
申请公布号 |
EP0971570(A1) |
申请公布日期 |
2000.01.12 |
申请号 |
EP19980901002 |
申请日期 |
1998.01.23 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TAKADA, MASARU;TSUKADA, KIYOTAKA;KOBAYASHI, HIROYUKI;MINOURA, HISASHI;UKAI, YOSHIKAZU;KONDO, MITSUHIRO |
分类号 |
B23K26/00;H01L21/48;H05K1/02;H05K1/03;H05K1/11;H05K1/18;H05K3/00;H05K3/34;H05K3/38;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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