发明名称 COATING LIQUID FOR FORMING LEVELING FILM
摘要 PROBLEM TO BE SOLVED: To obtain a coating liquid having a leveling capacity sufficient to cope with the integration and elaboration of semiconductor devices by dissolving a nitrogenous compound having at least one amino group substituted with at least either a hydroxyalkyl or an alkoxyalkyl in an organic solvent. SOLUTION: The nitrogenous compound is the one having, at least one, usually, one to three substituted amino groups and optionally having other substituents. The nitrogenous compound is desirably a triazine compound, particularly, methoxymethylated benzoguanamine. The organic solvent is particularly desirably an alkylene glycol monoalkyl ether or an ester thereof. For instance, this liquid is applied to a silicon wafer having a circuit pattern of a metal such as aluminum, dried, and baked at 150-250 deg.C for, usually, 1-30 min to form a leveling film.
申请公布号 JP2000007982(A) 申请公布日期 2000.01.11
申请号 JP19980177524 申请日期 1998.06.24
申请人 TOKYO OHKA KOGYO CO LTD 发明人 IGUCHI ETSUKO;HIROSAKI TAKAKO;KOBAYASHI MASAICHI
分类号 C09D161/26;H01L21/312;H01L21/768;H01L23/522 主分类号 C09D161/26
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