发明名称 METALLIC ION REPLENISHING DEVICE TO PLATING LIQUID AND REPLENISHING
摘要 PROBLEM TO BE SOLVED: To replenish ferromagnetic metallic ions at high speed and a low cost when the ferromagnetic metallic ions are replenished into a plating liq. in the plating of the ferromagnetic metal such as Fe, Ni and Co, or in the plating of an alloy incorporating these metals as components. SOLUTION: This metallic ion replenishing device consists of a plating vessel 5, which plates a material to be plated and a dissolving vessel 3 for replenishing the ferromagnetic metallic ions into the plating liq. 4 to be supplied to the plating vessel 5. The dissolving vessel 3 has a magnet 2 arranged so as to be in contact with the vessel wall and an agitator 8, which agitates the plating liq. 4, and is further provided with a liq. feed pump 6 for circulating the plating liq. to the plating vessel 5 from the dissolving vessel 3. The ferromagnetic metal 1 is charged into the plating liq. 4 and is fixed in a specified position of the dissolving vessel 3 by a magnetic force of the magnet 2. In the inside of the dissolving vessel, the plating liq. fluidizes by agitation, comes into contact with metal, and the removal of gaseous hydrogen, which covers the surface of metal when the relative flow rate between the ferromagnetic metal and the solution is 0.5 m/sec or above, is avoidable, whereby a high dissolving rate is obtd.
申请公布号 JP2000008199(A) 申请公布日期 2000.01.11
申请号 JP19980174851 申请日期 1998.06.22
申请人 NKK CORP 发明人 URAKAWA TAKAYUKI;SAGIYAMA MASARU
分类号 C25D3/12;C25D3/20;C25D3/56;C25D21/14;(IPC1-7):C25D21/14 主分类号 C25D3/12
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