发明名称 TREATMENT OF WORK AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To decrease a required amt. of washing liquid and to shorten the replacement time of the washing liquid by supplying a first washing liquid to a washing tank, washing works, supplying a second washing liquid into the washing tank to replace the washing liquid and discharging the residual liquid of a first supply piping and drain pipe, then washing the works by the second washing liquid. SOLUTION: A first washing liquid is supplied into a washing tank 1 and a semiconductor wafer carrying in and out device is actuated to carry semiconductor wafers 16 into a housing space. While the first washing liquid is supplied to the washing tank 1 and is made to flow over therefrom, the semiconductor wafers 16 are washed. Next, a second washing liquid is supplied to the washing tank 1 to allow the first washing liquid to flow over therefrom, by which the replacement of the washing liquid in the washing tank 1 is executed. A residual liquid on the upstream side of a juncture of a second supply piping 11 on the downstream side of a first supply piping 5 is discharged to a waste liquid tank 14 and the waste liquid of the drain pipe 13 is discharged to the waste liquid tank 15. The semiconductor wafers 16 are washed upon completion of the discharge while the second washing liquid is supplied to the washing tank 1 and is made to flow over therefrom.
申请公布号 JP2000005713(A) 申请公布日期 2000.01.11
申请号 JP19980175005 申请日期 1998.06.22
申请人 TOHO KASEI KK;DAIKIN IND LTD 发明人 MAEDA TOKUO;KI KANNAN;ONO MASAO
分类号 B08B3/10;H01L21/304;(IPC1-7):B08B3/10 主分类号 B08B3/10
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