| 摘要 |
PROBLEM TO BE SOLVED: To produce a liquid sealing resin composition having a low viscosity sufficient to seal a gap between a substrate and an IC chip and high reliability by regulating the maximum particle diameter, the average particle diameter, the ratio of the specific surface area to the theoretical specific area within specific ranges and forming the particle surfaces into smooth surfaces. SOLUTION: This fused spherical silica has 45μm maximum particle diameter, 2-10μm average particle diameter and 1.0-2.5 ratio SW1/SW2 of the specific surface area SW1 of the particle to theoretical specific surface area SW2 thereof. The fused spherical silica is produced by carrying out a wet treatment of a mixture of a fused spherical silica produced in an oxygen-combustible gas mixed flame with a removing agent for fine particles sticking to the fused spherical silica, peeling and removing the fine particles sticking to the surface of fused spherical silica. A caustic alkali, etc., are cited as the removing agent for the fine particles. A liquid sealing resin composition can be obtained by compounding 30-80 wt.% of the fused spherical silica with a liquid epoxy resin or a liquid silicone resin which is a liquid at normal temperature.
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