| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a dicing machine capable of easily performing an interrupt processing of a wafer W and continuously processing the wafer W one by one and performing a sampling inspection of the wafer W without stopping the dicing device. SOLUTION: A dicing machine 1 is provided with a plurality of special cassette receiving parts 32, 38 receiving at least one work and carries a wafer W between the plurality of special cassette receiving parts 32, 38 and a work cutting part 10 and carries the wafer W taken out of cassette receiving parts 34, 36 and cut with the work cutting part 10 to the special cassette receiving parts 32, 38.</p> |
