| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition for sealing a semiconductor, not generating a leak defect and a short circuit defect and excellent in insulation reliability by containing an epoxy resin, a phenolic resin curing agent, a curing accelerator, an inorganic filler and a carbon black as indispensable components. SOLUTION: This epoxy resin composition contains (A) an epoxy resin (e.g.; a bisphenol type epoxy resin), (B) a phenolic resin hardener (e.g.; a phenol novolac resin), (C) hardening accelerator [e.g.; 1,8-diazabicyclo(5,4,0)undecene-7], (D) preferably 60-92 wt.% inorganic filler (a fused silica powder) based on the total resin composition and (E) a carbon black (e.g.; a furnace black) as indispensable components. The maximum particle diameter of the aggregates of the component (E) is <=100μm. The composition can be compounded with as necessary, a silane coupling agent, a releasing agent such as a carnauba wax, a low stress agent such as a silicone oil, a flame retardant such as antimony trioxide, etc.
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