发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain the subject epoxy resin composition excellent in high temperature storage properties and containing an epoxy resin, a phenolic resin, an activated carbon, an inorganic filler, a curing accelerator and a brominated epoxy resin as indispensable components. SOLUTION: This epoxy resin composition contains (A) an epoxy resin (e.g.; an ortho-cresol novolak type epoxy resin), (B) a phenolic resin (e.g.; a phenol novolak resin), (C) 0.1-5 wt.% activated carbon based on the total composition (e.g.; plant-based), (D) an inorganic filler (e.g.; fused and crushed silica particles), (E) a hardening accelerator [e.g.; 1,8-diazabicyclo(5,4,0) undecene-7] and (F) preferably 0.1-3 wt.%, as an amount of bromine based on the total composition, brominated epoxy resin (e.g.; a brominated phenol novolak type epoxy resin) as indispensable components. The component (C) preferably has 10-100μm mean particle diameter and 800-3,500 m2/g specific surface area measured by BET method.
申请公布号 JP2000007892(A) 申请公布日期 2000.01.11
申请号 JP19980172446 申请日期 1998.06.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 FUJITA HIROSHI
分类号 C08K3/00;C08G59/30;C08K3/04;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08K3/00
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