| 摘要 |
PROBLEM TO BE SOLVED: To provide a vapor deposition device using a coaxial type vacuum arc vapor depositing source capable of forming a film of materials other than electrically conductive materials, particularly of insulating materials. SOLUTION: The inside of a vacuum treting tank 10 is provided with vapor depositing sources 21a to 21e, in a state in which voltage is applied on the space between an anode electrode and a vapor depositing material, generating trigger discharge on the space between a trigger electrode and the vapor depositing material and inducing arc discharge on the space between the anode electrode and the vapor depositing material to evaporate the vapor depositing material. The inside of the vacuum treating tank 10 is provided with a gas introducing means 60 for introducing a reactive gas G into the vacuum treating tank 10. The outgoing port 62a of a gas pipe of a gas introducing means 60 is arranged in the vicinity in the lower direction of a substrate 4.
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