| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device which is capable of simply rotating a cylindrical electrode. SOLUTION: The plating device 1 forms a plating on a hollow part 2a by inserting the cylindrical electrode 10 having ejecting holes from above into the hollow part 2a of a cylinder block 2, while spraying a combined plating liq. 6 on the hollow part 2a via the ejecting holes from the cylindrical electrode 10. In this case, a rotating means 20, which rotates the cylindrical electrode 10 around the axis thereof, and a rotary connector 51 to the cylindrical electrode 10 are arranged above the liq. level 6a of the combined plating liq. 6 housed into the hollow part 2a.
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