发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition having not only high adhesivity but also excellent weather resistance and useful as both a joint sealer and an adhesive for adhering tiles. SOLUTION: This curable resin composition comprises (A) 100 pts.wt. of saturated hydrocarbon-based polymer having at least one silicon atom-containing group which has a hydroxyl group or hydrolyzable group bound to a silicon atom and can form a siloxane bond to cross-link the polymer, (B) 10-500 pts.wt. of an epoxy resin, (C) 0.1-20 pts.wt. of a silanol condensation catalyst, and (D) an epoxy resin curing agent in an amount of 0.1-300 pts.wt. per 100 pts.wt. of the component B.
申请公布号 JP2000007861(A) 申请公布日期 2000.01.11
申请号 JP19980176031 申请日期 1998.06.23
申请人 SEKISUI CHEM CO LTD 发明人 MURAYAMA YUKIHIKO
分类号 C08K5/57;C08L23/26;C08L63/00;C09J123/26;C09J163/00;(IPC1-7):C08L23/26 主分类号 C08K5/57
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