Semiconductor device with improved connection reliability

摘要

A semiconductor device comprises a substrate on which a plurality of external connection terminals are formed, and a semiconductor chip provided with a plurality of connection terminals. The connection terminals are connected to corresponding external connection terminals by electrical wiring. Each of predetermined connection terminals in the connection terminals of the semiconductor chip is connected to two or more corresponding external connection terminals on the substrate. Preferably, 90% or more of the connection terminals of the semiconductor chip are connected to two or more corresponding external connection terminals. When the semiconductor device is installed on a circuit board, the semiconductor device is mounted on the circuit board with its external connection terminals facing the circuit board, and electric connections between the semiconductor device and the circuit board is established by the external connection terminals. According to the semiconductor device, connection reliability between the semiconductor device and the circuit board can be remarkably improved and installation process can be executed with a higher success rate and a remarkably higher degree of efficiency.