| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for treating a substrate by which thermal uniformity of a substrate at an upper part of a boat can be improved and further number of substrates to be treated can be increased. SOLUTION: A boat 20 on which wafers 1 are mounted is inserted into a reaction tube 3 and a processing gas 10 is introduced in a shower shape from a ceiling part of the reaction tube 3 while heating the wafers 1 by a heater 7. A part of introduced processing gas 10 of low temp. flowing down through holes 26 in a top plate 21 is heated by contacting with an insulating board 25 disposed between the top plate 21 and the wafer 1 at an uppermost part of the boat and the heated processing gas flows through respective wafers 1. Further heat radiation upwards from the wafers 1 at the upper part of the boat 20 is shut off by the opaque insulating board 25 to raise heat retaining property of the upper part of the boat 20 and to improve thermal uniformity of the wafers 1.
|
