| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject highly reliable and moldable epoxy resin composition with suppressed mold stain and the malappearance of the molded products thereof and securing good workability in mounting such molded products by essentially including specific epoxy resin (s), a phenolic curing agent, a curing promoter, a polyolefin-based releasant and an inorganic filler. SOLUTION: This composition is obtained by essentially including (A) at least one kind of epoxy resin of formula I, formula II ((n) is a repeating number of as an integer of >=1) or formula III, (B) a phenolic hardener (e.g. a phenolic resin of formula IV) in the equivalent ratio of pref. 0.8-1.3 based on the component A, (C) a hardening accelerator (e.g. an adduct of triphenylphosphine and benzoquinone), (D) 0.5-10 pts.wt., based on the component A, of a polyolefin- based releasant with a number-average molecular weight of 500-20,000, dripping point of 30-80 deg.C and acid value of 10-50 mgKOG/g, and (E) 70-90 wt.%, based on the whole composition, of an inorganic filler (e.g. fused silica). |
