| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the subject epoxy resin composition equipped simultaneously with a low stress property and a moisture resistant reliability by including an epoxy resin, a phenolic resin and specific butadiene-based rubber particles. SOLUTION: This epoxy resin composition for the sealing of a semiconductor, is obtained by containing (A) an epoxy resin (e.g.; a dicyclopentadiene type epoxy resin), (B) a phenolic resin (e.g.; a dicyclopentadiene type phenol resin), (C) preferably 0.1-4.0 wt.%, based on the total composition, butadiene-based rubber particles having <=100μm mean particle diameter of secondary particles, >=97 wt.% content of particles having <=250μm, and >=80 wt.% content of particles having <=150μm (e.g.; a methyl acrylate-butadiene-styrene copolymer) and preferably (D) a silicone oil having at least one amino group in one molecule. The compounding ratio of the components (A) to (B) is preferably to become 0.8-1.2 equivalent hydroxy group equivalent in the component (B) based on one equivalent of the epoxy group in the component (A).</p> |
