发明名称 SEALANT FILM AND RESIN COMPOSITION THEREFOR
摘要 PROBLEM TO BE SOLVED: To obtain a resin compsn. for a sealant film excellent in low temp. heat sealability, heat seal strength, blocking resistance or the like and the sealant film. SOLUTION: A resin compsn. for a sealant film consists of (A) 65-35 wt.% straight chain low density polyethylene, (B) 45-15 wt.% ethylene/α-olefin random copolymer with a density of 0.850-0.900 g/cm3 and a melt flow rate(MFR) measured under a condition of 190 deg.C and 2.16 kg load of 0.1-50 g/10 min and (C) 5-40 wt.% butene/α-olefin random copolymer with a 1-butene content of 50-99 mol.% and a melt flow rate(MFR) measured under a condition of 190 deg.C and 2.16 kg load of 0.1-20 g/10 min and the sealant film is obtained by laminating the sealant layer comprising this resin compsn. on an olefin base material layer.
申请公布号 JP2000006338(A) 申请公布日期 2000.01.11
申请号 JP19980174461 申请日期 1998.06.22
申请人 MITSUI CHEMICALS INC 发明人 NAKAGAWA NORIHIKO;TANAKA YASUO
分类号 B32B27/32;C08L23/08;C08L23/20;(IPC1-7):B32B27/32 主分类号 B32B27/32
代理机构 代理人
主权项
地址