| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate handling method which can prevent particles effectively from adhering to the back surface of a substrate, and restrain stress applied to the substrate at the time of suction by a vacuum chuck. SOLUTION: A means having a plurality of small holes 22 almost evenly dispersed in the plane of a perforated plate 20 of conductive material, which is electrically-grounded, is fitted to the suction part of a vacuum chuck 10a attractively-retaining a substrata 2. The section of the perforated plate 20 is evacuated even in any case other than where the substrate 2 is sucked.</p> |
