| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of being formed into a B-stage film in a short period of time by actinic light irradiation or heat treatment and, at the same time, allowing the B-stage film to melt cure by heating, a thermo-setting film obtainable therefrom, and a bonding method using the same composition or film. SOLUTION: This liquid epoxy resin composition comprises (i) a liquid epoxy resin having one alkenyl group in the molecule, (ii) a latent curing agent, (iii) a compound having at least one mercapto group in the molecule. A desired thermosetting film is composed of a cured product of the epoxy resin composition. A desired method for bonding two materials to be bonded comprises the steps of filling a composition between the two materials to form a composition layer; solidifying the composition layer to form a thermosetting resin film layer; and heating the thermosetting film layer to melt the film and then, curing the melted film to form a cured resin film layer.
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