发明名称 Semiconductor device with refractory metal element
摘要 A semiconductor device includes a self-aligned refractory metal constituent in a recess in a semiconductor substrate and having the same plane pattern as a bottom surface of the recess. The width of the constituent is determined by the plane pattern of the recess and, accordingly, the pattern width of the constituent is easily controlled by the plane pattern of the recess.
申请公布号 US6013926(A) 申请公布日期 2000.01.11
申请号 US19970837458 申请日期 1997.04.18
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OKU, TOMOKI;YOSHIDA, NAOHITO;MIYAKUNI, SHINICHI;SHIGA, TOSHIHIKO
分类号 H01L29/41;H01L21/285;H01L21/3205;H01L21/335;H01L21/338;H01L29/778;H01L29/812;H03H3/02;(IPC1-7):H01L29/80;H01L31/032;H01L31/112 主分类号 H01L29/41
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