| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic equipment having an equipment body which does not generate deformation in the case where a material is pushed out from the inside of a die device by an ejector pin, its manufacturing method, and a die device. SOLUTION: This equipment comprises a body 20, and an increased wall portion 21 which is arranged at an abutting portion of an ejector pin from the inside of a die device of the body 20, and is thicker than the other portion of the body 20. Therefore, even if a die molding is extruded from the inside of the die device while abutting the ejector pin to the wall portion, the wall portion is prevented from indentations and deformation.
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