| 摘要 |
PROBLEM TO BE SOLVED: To provide the method which enables enhancement of uniformity in film thickness distribution at the time of forming a thin film while allowing a substrate to revolve and autorotate. SOLUTION: This method comprises growing a thin film on a substrate placed on a rotary susceptor that is disposed in a reaction furnace, while allowing the substrate to revolve and autorotate. In the method, conditions which provide a positive quadratic differential coefficient of the film thickness distribution in such a state that the substrate is allowed to revolve, however, not allowed to autorotate, are found and under the conditions which provide a positive quadratic differential coefficient of the film thickness distribution, a thin film is grown while allowing the substrate to revolve and autorotate.
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