发明名称 METHOD AND DEVICE FOR SOLID JOINTING
摘要 PROBLEM TO BE SOLVED: To joint a large member to be jointed without usage of a jointing material. SOLUTION: One jointed member 42 composed of a copper plate is inserted in a quean acid soluble 38 of an electrolytic treatment part 30 to be used as a cathode, so as to reduce an oxidation film by the electrolytic treatment. Thereafter, the jointed member 42 being electrolytically treated is washed by ethyl alcohol 52 of the first washing part and acetone 60 of the second washing part 48, and is disposed on a base plate 84 of a joint treatment part 34. After the other jointed member 62 composed of tin is disposed in a fluoridation treating chamber 64 of the fluoridation treating part 32, and a joint face is fluoridated by the fluorine gas generated at a discharging unit 68, and is disposed on the jointed member 42. Then, while a joint treating chamber 78 is made under a nitrogen atmosphere and a cylinder 80 is actuated to pressurize the jointed members 42, 62, the jointed members 42, 62 are heated to the temperature below their melting points and jointed together.
申请公布号 JP2000005885(A) 申请公布日期 2000.01.11
申请号 JP19980173162 申请日期 1998.06.19
申请人 SEIKO EPSON CORP 发明人 AOKI KOJI;MORI YOSHIAKI
分类号 B23H3/00;B23K20/00;B23K20/10;B23K20/14;(IPC1-7):B23K20/00 主分类号 B23H3/00
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