发明名称 COPPER SHEET COMPOSITE MATERIAL
摘要 PROBLEM TO BE SOLVED: To improve thermal conductivity by forming a copper sheet composite material by providing a base wherein a copper-plated layer is formed on one side, and joining a copper sheet to one side of the base with the copper-plated layer therebetween. SOLUTION: A copper sheet composite material is formed by laminating a nickel-plated layer 2 and a copper-plated layer 3 on one side of an aluminum base 1. The nickel-plated layer 2 is formed to improve bond strength between the aluminum base 1 and the copper-plated layer 3. A copper sheet 6 is joined to one side of the base 1 with the copper-plated layer 3 therebetween. The joining is performed by metal diffusion between the copper sheet 6 and the copper-plated layer 3. Thereby, a thermal conductivity of the copper sheet 6 is twice as high as that of aluminum, and the thermal conductivity is improved. A metal-plated layer is not required on a surface of the copper sheet 6, and the bond strength is improved by approximately 50%.
申请公布号 JP2000006306(A) 申请公布日期 2000.01.11
申请号 JP19980177088 申请日期 1998.06.24
申请人 SUMITOMO ELECTRIC IND LTD 发明人 OGA TAKESHI;KIZAWA KAZUHIRO
分类号 A47J36/02;B23K20/00;B23K20/02;B32B15/01;(IPC1-7):B32B15/01 主分类号 A47J36/02
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