发明名称 |
COPPER SHEET COMPOSITE MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To improve thermal conductivity by forming a copper sheet composite material by providing a base wherein a copper-plated layer is formed on one side, and joining a copper sheet to one side of the base with the copper-plated layer therebetween. SOLUTION: A copper sheet composite material is formed by laminating a nickel-plated layer 2 and a copper-plated layer 3 on one side of an aluminum base 1. The nickel-plated layer 2 is formed to improve bond strength between the aluminum base 1 and the copper-plated layer 3. A copper sheet 6 is joined to one side of the base 1 with the copper-plated layer 3 therebetween. The joining is performed by metal diffusion between the copper sheet 6 and the copper-plated layer 3. Thereby, a thermal conductivity of the copper sheet 6 is twice as high as that of aluminum, and the thermal conductivity is improved. A metal-plated layer is not required on a surface of the copper sheet 6, and the bond strength is improved by approximately 50%.
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申请公布号 |
JP2000006306(A) |
申请公布日期 |
2000.01.11 |
申请号 |
JP19980177088 |
申请日期 |
1998.06.24 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
OGA TAKESHI;KIZAWA KAZUHIRO |
分类号 |
A47J36/02;B23K20/00;B23K20/02;B32B15/01;(IPC1-7):B32B15/01 |
主分类号 |
A47J36/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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