| 摘要 |
PROBLEM TO BE SOLVED: To enable the application of a good plating even when the plating treatment is executed by successively replacing a wafer, on the surface to be plated a seed metal of which is previously applied, with a cup type plating device. SOLUTION: In the cup type plating device, the plating is applied by placing the circumferential edge part of the wafer 6 on a wafer supporting part 5 formed by allowing a specified width to be exposed on the inner circumferential edge of a seal gasket 3 by arranging the seal gasket 3 with a cathode electrode along an opening 2 in a plating vessel 1 and fitting a top ring 4 thereto. In this case, constitution is made so that a plating liq. stuck to the wafer supporting part 5 is sucked to be removed.
|
