A method of manufacturing a semiconductor device comprising the steps of: ionizing decaborane; and implanting ionized decaborane into a silicon wafer. Solid decaborane can be vaporized in a reduced pressure atmosphere or by heating. A single decaborane molecule can provide 10 boron atoms while the acceleration energy per each boron atom can be reduced to about +E,fra 1/10+EE of the acceleration energy for a decaborane molecule.
申请公布号
US6013332(A)
申请公布日期
2000.01.11
申请号
US19960762853
申请日期
1996.12.06
申请人
FUJITSU LIMITED;JAPAN SCIENCE AND TECHNOLOGY CORPORATION