| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition with excellent thermal shock resistance and moisture resistance, useful for the electrical insulation coating of electrical/electronic parts by essentially including an epoxy resin, a curing agent and a filler and also including a thermal shock resistance improving material and a compatibilizing agent. SOLUTION: This composition is obtained by essentially including (A) an epoxy resin (e.g. bisphenol A-type epoxy resin), (B) a hardener (e.g. an acid anhydride) and (C) a filler, and also including (D) pref. 1-20 wt.%, based on the whole composition, of a thermal shock resistance improving material (e.g. styrene-butadiene rubber) and (E) pref. 1-50 pts.wt., per pt.wt. of the component D, of a compatibilizing agent for the components A and D; wherein it is preferable that the component D is a thermoplastic resin with a melting point of >=150 deg.C and average primary particle size of <=10μm; the component E is such one as to have epoxy group in the molecule; and the component C comprises an inorganic compound 5-20μm in average particle size. |
