POLYIMIDE PRECURSOR RESIN COMPOSITION AND PREPARATION THEREOF

摘要

PROBLEM TO BE SOLVED: To provide polyimide precursor resin compositions useful as interlaminar insulating layers and surface protective films of electronic parts such as semiconductor integrated circuits and high density packaging substrates and a method for preparing the same. SOLUTION: This polymide precursor resin composition comprises a polyimide precursor resin having a repeating unit represented by the general formula (I) (wherein R1 is a tetravalent aromatic group; R2 and R3 are each independently H or a 1-4C alkyl; R4 is an aromatic group; R5 is carboxy and/or phenolic hydroxy; and n is an integer of not less than 1) and the method for preparing the polyimide precursor resin composition comprises adding a >=4C alcohol to an aromatic tetrabasic acid dianhydride in a solvent and heating the resulting mixture solution to converting part of or the entire of the aromatic tetrabasic acid dianhydride into the diester of the tetrabasic acid and subsequently reacting the resulting diester with an aromatic diamine compound having a carboxy group and/or a phenolic hydroxy group to produce the polyimide precursor.