| 摘要 |
A process for mounting a surface-mount component(12), such as a stick-leaded device, to a circuit board (10) having a pair of plated through-holes and at least one additional through-hole (20), each of which extends through the circuit board (10). The leads (16) of the component (12) are then inserted into the plated through-holes so as to position the component (12) on a first side of the circuit board (10), after which a material (14) is applied to the second (opposite) side of the circuit board (10) so that the material (14) flows through the second through-hole (20), contacts the component (12), and bonds the component (12) to the first side of the circuit board (10). For this purpose, the material (14) preferably contacts the entire surface (18) of the component (12) facing a near surface region of the circuit board (10) and bonds the component surface (18) to the surface region. |
