PROCEDE ET MACHINE POUR LA LIAISON DES PLOTS DE CONNEXION D'UNEPASTILLEDE CIRCUIT ELECTRONIQUE A DES CONDUCTEURS DE

摘要

1294973 Welding by pressure MOTOROLA Inc 3 Feb 1970 [12 Feb 1969] 5053/70 Heading B3R A machine for bonding a die 30 having a plurality of electrodes 32 to the leads 20 of a substrate 14 comprises two locating pins 22 adapted to extend through holes in the substrate 14 so as to locate it accurately on a support surface or bonding anvil 18, and a receptacle 26 which is movable horizontally into a position in close proximity to the substrate, the receptacle having a slot 27 adapted to receive a die and position it with its electrodes in contact with the leads 20. The bonding is effected by means of an ultrasonic bonding needle which is movable vertically downwards to hold the die in position while the die receptacle is moved away prior to the actual bonding step. The slot 27 has partly sloping wall portions 29 adapted to accommodate dies having slightly irregularly cut edges.