发明名称 FILM FORMING DEVICE AND CLEANING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To efficiently and uniformly clean a film forming chamber without excessively consuming constitutional member by heating the chamber to a prescribed temp. successively from one end toward the other end by a heating means and introducing a cleaning gas from one end toward the other end. SOLUTION: In a film forming chamber 2 consisting of an inner tube 2a and an outer tube 2b, a wafer port 1 on which a wafer is placed is disposed, and a film forming gas is introduced while heating the chamber 2 to a prescribed temp. by a heating means 3 to form a film on the wafer. In this film forming device, after the completion of the film forming stage, the film forming chamber 2 is heated to a prescribed temp. by a heating means 3, furthermore, a cleaning gas is introduced from a cleaning gas introducing means 4 at the lower part and is allowed to flow toward the upper part, then deposits on the constitutional member are decomposed and are removed from an exhaust port. At this time, the heating means 3 is composed of a plurality of heating units 31 to 35 respectively capable of controlling temp., and the film forming chamber 2 is heated to a prescribed temp. from the lower part toward the upper part successively.
申请公布号 JP2000001783(A) 申请公布日期 2000.01.07
申请号 JP19980167070 申请日期 1998.06.15
申请人 SONY CORP 发明人 MUROYAMA MASAKAZU
分类号 C23C16/44;C23C16/50;C23F4/00;H01L21/205;H01L21/22;H01L21/302;H01L21/3065;(IPC1-7):C23C16/44;H01L21/306 主分类号 C23C16/44
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