| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bus bar capable of being miniaturized and a circuit board having a bonding part to a bus bar tab. SOLUTION: A bus bar 11 is formed with the predetermined thickness (t) in response to the capacity of the current flowing in the bus bar 11, and an end 11a thereof is formed at a thickness (t)/2, which is a half of the predetermined thickness (t). Meanwhile, a bus bar tab 12 is formed by bending and provided with a bonding end 12a to be bonded to the end 11a and a tube 12c. The bonding end 12a and the tub 12c are formed with the thickness (t)/2. The bus bar 11 and the bus bar tab 12 are bonded to each other by placing the bonding end 12a on the end 11a, and by subjecting it to ultrasonic welding or the like.</p> |
