发明名称 WAFER CHAMFERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer chamfering device to seal a moving mechanism for a wafer without any gap through simple constitution. SOLUTION: An opening part 132A is formed in an oil pan 132 recovering a coolant, so that a chuck table 100 is movable. The lower end part of a cover 134 formed in a cylindrical shape is fixed in the oil pan 132 to shield the opening part 132A. The upper end part of a cover 134 is fixed at a mounting plate 124 mounted on aθshaft motor 96.
申请公布号 JP2000000745(A) 申请公布日期 2000.01.07
申请号 JP19980166991 申请日期 1998.06.15
申请人 TOKYO SEIMITSU CO LTD 发明人 KATAYAMA ICHIRO;IWAKI MASATAMI
分类号 B24B9/00;B23Q11/00;B24B55/12;H01L21/304;(IPC1-7):B24B9/00 主分类号 B24B9/00
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