| 摘要 |
PROBLEM TO BE SOLVED: To prevent signals inputted into or outputted from a semiconductor chip from deteriorating in quality. SOLUTION: A wiring pattern 18 is arranged on a flexible insulating tape 12 with a device hole 16. One end of the wiring pattern 18 is made to protrude from the device hole 16, and these inner leads and a semiconductor chip 14 are connected together, whereby signals are inputted into or outputted from the semiconductor chip 14 through the intermediary of the wiring pattern 18. A region 28 where no wiring pattern 18 is provided is located at each corner of the device hole 16, and a dummy pattern 30 is provided in the regions 28 respectively. The dummy pattern 30 is electrically connected to the adjacent wiring pattern 18, and the wiring pattern 18 serve as a grounding pattern, so that the dummy pattern 30 is stably kept at a grounding potential, and the dummy pattern 30 can be prevented from becoming a noise source to affect the wiring pattern 18. |
