| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit device and an assembling method thereof, where a CSP(chip size package) can be joined to a mother board even if the CSP is possessed of solder bumps which are different in number and arrangement, and the solder bumps can be lessened in thermal stress. SOLUTION: A mother board 20 is equipped with a prescribed number of connection pads 21 arranged in a matrix, a carrier 30 which is equipped with ball-shaped solder bumps 32 arranged in a matrix on its underside and pads 33 electrically connected to solder bumps covered with a solder resist 35 and arranged on its upside is mounted on the mother board 20, and the connection pads 21 and the solder bumps 32 are connected together with solder paste 22. A CSP 40 possessed of ball-shaped solder bumps 41 arranged in a matrix on its underside is mounted on the carrier 30, and the solder bumps 41 of the CSP 40 are mounted on the pads 33 of the carrier 30. When a CSP is possessed of solder bumps different in number and arrangement, it can be joined to a mother board by reflow soldering under same conditions at the same time if the bumps are arranged at the same pitch, and the number and arrangement of bumps are within a certain range, and a solder bump of two-layered structure absorbs thermal strain.
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