| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer chamfering device to perform high-precise chamfering of a wafer and facilitate maintenance. SOLUTION: This wafer chamfering device comprises two notch spindles of one being a first notch spindle 120A on which a grinding wheel 122A for rough-grinding a notch; and the other being a second notch spindle 120B on which a grinding wheel 122B for precise-grinding a notch is mounted. Thereby, rough grounding and precise grinding of a wafer W are effected by a single wafer chamfering device. Further, since the notch spindles 120A and 120B are arranged in a position offset against a central position (an Y-axis), maintenance is facilitated.
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