发明名称 MANUFACTURE OF LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component which can obtain stable characteristics, when component mounting direction is changed by the shape and the position of a terminal electrode. SOLUTION: Sheets B1-B4 for coil layers, where four kinds of U-shaped conductors Pb1-Pb4 for coils are so formed that these end portions overlap with through-holes (h) are laminated, so that the respective conductors Pb1-Pb4 for coils of the sheets are connected spirally in the laminating direction via the through-holes (h) filled with the conductors. On both sides of the laminating direction, a plurality of green sheets A and C having the through-holes (h) filled with conductors are so laminated that the respective through-hole filling conductors of the sheets are made continuous in a pillar type in the laminating direction, and the through-hole filling conductors of one ends are connected with the conductors Pb1 and Pb4 for coils at the ends of the laminating direction. The overall body of a laminated member is compression-bonded, the laminated member after compression-bonding is baked, and terminal electrodes are formed facing opposite at the end portions in the laminating direction of the laminating member after baking, so as to be connect with the exposed ends of the through-hole filling conductors at the laminating direction ends.
申请公布号 JP2000003827(A) 申请公布日期 2000.01.07
申请号 JP19990116006 申请日期 1999.04.23
申请人 TAIYO YUDEN CO LTD 发明人 IWAO HIDEMI
分类号 H01F41/04;H01F17/00;(IPC1-7):H01F41/04 主分类号 H01F41/04
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