| 摘要 |
PROBLEM TO BE SOLVED: To enhance a semiconductor device in heat dissipating properties by heat conduction. SOLUTION: A QFP IC 28 is equipped with a pellet 22, a tab 16 to which the pellet 22 is bonded, inner leads 18 linked to outer leads 19 and electrically connected to the pellet 22, and a resin encapsulation body 25 which seals up the pellet 22, the tab 16, and the inner leads 18, where the tab 16 is exposed at the underside of the resin encapsulation body 25, and the tip of a connector 20 linked to the tab 16 is made to protrude sideways at the periphery of the underside of the resin encapsulation body 25. A visual inspection of the soldered part of the underside of the tab to the land of a printed wiring board can be carried out by observing the soldered part formed on the connector 20. The tab 16 exposed on the underside of the resin encapsulation body is soldered to the lands on the printed wiring board, whereby heat released from the pellet is discharged out to the printed wiring board by thermal conduction, and a semiconductor device of this constitution can be improved in heat dissipating properties. |
