| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor device which is capable of cutting off a fuse accurately and lessening a laser trimming positioning pattern in area occupied by it in a scribe line region, wherein the semiconductor device is used to trim a fuse with a laser beam. SOLUTION: A laser trimming positioning pattern has a structure where a boundary between a high-light reflectivity region 106 and a low-light reflectivity region 107 or a point where it changes sharply in light reflectivity is specified by a pattern formed of the same thin film with a fuse element. Furthermore, a preferable relation between the inner dimensions of the laser trimming positioning pattern and the spot diameter of a laser beam is determined. The laser trimming positioning pattern is formed in an existing pad region in a semiconductor integrated circuit chip or arranged at the intersection of the scribe lines so as to be a continuous structure which functions both as a so- calledθmark that is used for the comparatively coarse alignment of a semiconductor wafer in the direction of rotation and as a trimming mark that is used for the accurate alignment of each arranged semiconductor circuit, whereby the laser trimming positioning pattern can be lessened in area. |
