发明名称 BONDING METHOD FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide bonding means for a substrate, wherein uniform pressure is applied on a laminated substrate. SOLUTION: Pressure members comprise a first upper clear plate 1, having planar shape and a second upper clear plate 3 whose upper surface is spherical, both of which are placed on a laminated substrate 1. If monochromatic light is irradiated thereon, Newton's rings are observed as interference fringes. If pressure is applied on the clear plates, the gap between the two clear plates changes de to deformation of the clear plates, and thereby, the interference fringes change. The changes in the interference fringes are observed and pressure is applied, while adjusting a pressure distribution by a pressure adjusting bolts 11, corresponding to the changes in the interference fringes. Thereby, uniform applied pressure on the laminated substrate 1 can be realized.
申请公布号 JP2000003841(A) 申请公布日期 2000.01.07
申请号 JP19980167015 申请日期 1998.06.15
申请人 HAMAMATSU PHOTONICS KK 发明人 SAITO MASAYUKI;OKAMOTO HIROSHI;SHINODA KAZUNORI
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
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